Adhesion & Bonding Expo 2026 Osaka will be held from 13th - 15th May 2026 at INTEX Osaka in Japan. This is a leading industrial trade fair dedicated to showcasing the latest advancements in adhesive and bonding technologies. It offers a comprehensive platform for professionals and businesses to explore a wide range of products, services, and solutions related to adhesion and bonding. It caters to various industries, including automotive, electronics, construction, and more.
Exhibitor Profile
This exhibition/conference is open for all companies, including organizations with products/services or topics related to the following : Adhesive Agent, Adhesive Film/Tapes, Joining Equipment/ Technology -Laser -Friction -Ultrasonic Diffusion -Bonding Robot Surface Processing Device, Testing/Measurement/ Analysis, Design Simulation Tool.
Visitors Profile
Business Visitors are Automobile/Railroad/ Shipbuilding, Electric/Electronic Device, Construction/ Building Material, Industrial Equipment, Aerospace, Material Manufacturer.
Exhibition Hall Location
INTEX Osaka
INTEX Osaka
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